Multi-layer flexible circuits typically consist of two or more layers which can be bonded together in different ways, depending on how much flexibility your application requires. This Technology is becoming more widely used due to the compact size and function and because the individual layers do not necessarily have to be laminated together which allows for more flexibility. Contact Northpoint Technologies experienced engineer to discuss a design that meets your specifications.
| Item | Parameter | |
| Numberof Layers | 1-6 | |
| Minimum Circuit Width | .12″ | |
| Minimum Circuit Clearence | .12″ | |
| Minimum Anular Ring | .003″ | |
| Minimum Hole | .009″ | |
| Minumum Copper Thickness | 18µm | |
| Maximum Copper Thickness | 70µm | |
| Substrate Thickness | Polyimide | 12.5µm-50µm |
| Maximum Board Size | 20″ x 31″ | |
| Hole Tolerance | NPTH | +/- .002″ |
| PTH | +/- .003″ | |
| Circuit/Gap | Inner | .003″-.004″ |
| Outside | .003″-.005″ | |
| Outline Tolerance | +/-.003 | |
| Surface Finish | Immersion Gold | |
| Immersion Silver | ||
| Tin Plating | ||
| OSP | ||
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