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PRODUCT
FEATURES
• Single
or Double Sided Circuitry
• Multilayers,
2 to 6 FPC & Rigid-Flex
• Lines
and Spaces: Single sided .002”,
Double sided .003-.004”
• Installation
of Connectors, Pins, Contacts, etc.
• Assembly
including SMD
• Stiffener
Supported Areas (using FR-4, Polyamide, Polyester, etc.)
• Unsupported
Fingers
• Blind
and buried vias
• Controlled
impedance
• Selective
Adhesive
• Shielding,
solid or patterned
• Forming
and Creasing
• Circuits
up to 18" x 24"
CERTIFICATION
• UL
Approved
• ISO-9001:2000
• IPC-2221
• IPC-2223
SURFACE
TREATMENT & FINISHES
• Hard
or Soft Gold
• Hot
Air Level (H.A.L).
• Carbon
Printing
• Screen
Print Solder Mask
• Tin
Plating - Electroless and Electrolytic
• Silver
• Nickel
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MATERIALS
Substrates
• Kapton®:
Polyimide 1/2 – 5 mils
• Mylar®:
Polyester 2 - 5 mils
• Epoxy
• Teflon
Copper
• 1/2
ounce to 7 ounces
• Rolled-annealed
• Half
Hard Electro-deposited
Adhesives
• Modified
Acrylic
• Modified
Epoxy
• Pressure
Sensitive (PSA)
SOLDER
MASK/COVERLAY
•
Kapton®
Coverlay 1/2 mil to 5 mils
•
Polyester
Coverlay 1 mil to 3 mils
•
Photoimageable
Coverlay
•
Soldermask
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