PRODUCT FEATURES
• Single or Double Sided Circuitry
• Multilayers, 2 to 6 FPC & Rigid-Flex
• Lines and Spaces: Single sided .002”,
Double sided .003-.004”
• Installation of Connectors, Pins, Contacts, etc.
• Assembly including SMD
• Stiffener Supported Areas (using FR-4, Polyamide, Polyester, etc.)
• Unsupported Fingers
• Blind and buried vias
• Controlled impedance
• Selective Adhesive
• Shielding, solid or patterned
• Forming and Creasing
• Circuits up to 18" x 24"

CERTIFICATION
• UL Approved
• ISO-9001:2000
• IPC-2221
• IPC-2223

SURFACE TREATMENT & FINISHES
• Hard or Soft Gold
• Hot Air Level (H.A.L).
• Carbon Printing
• Screen Print Solder Mask
• Tin Plating - Electroless and Electrolytic
• Silver
• Nickel

MATERIALS
Substrates
• Kapton^®: Polyimide 1/2 – 5 mils
• Mylar^®: Polyester 2 - 5 mils
• Epoxy
• Teflon
Copper
• 1/2 ounce to 7 ounces
• Rolled-annealed
• Half Hard Electro-deposited
Adhesives
• Modified Acrylic
• Modified Epoxy
• Pressure Sensitive (PSA)

SOLDER MASK/COVERLAY
• Kapton^® Coverlay 1/2 mil to 5 mils
• Polyester Coverlay 1 mil to 3 mils
• Photoimageable Coverlay
• Soldermask